Thermal Designer | Heat Dissipation Tool

Thermal Guard

Junction Temperature Analysis
325°C DANGER: OVERHEAT
Standard $T_{J(max)}$ for silicon is usually 125°C – 150°C.
If the temperature exceeds this, a heatsink is required.

Thermal management is modeled using an analogy to Ohm’s Law:

  • Temperature Difference (ΔT) is like Voltage (V).
  • Power Dissipation (P) is like Current (I).
  • Thermal Resistance (Rθ​) is like Electrical Resistance (R).

Core Formulas:

Thermal Interface Material (TIM): Never ignore the resistance between the component and the heatsink (RθCS​). Using thermal paste can reduce this from ~2.0 °C/W to less than 0.2 °C/W.

Derating: For high reliability (military or industrial), engineers “derate” components, meaning they design for a maximum TJ​ of 100°C even if the datasheet says 150°C.

Natural vs. Forced Convection: If your required RθSA​ is too low to achieve with a standard heatsink, you must add a fan (Forced Convection). A fan can improve thermal performance by 2x to 10x.

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